- 英文名称
- 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl
- 分子式
- C22H26O4
- 分子量
- 354.44
- 中文别名
- 3,3',5,5'-四甲基联苯二酚二缩水甘油醚; 四甲基联苯二酚二缩水甘油醚; 3,3',5,5'-四甲基联苯双酚二缩水甘; 2,2'-(((3,3',5,5'-四甲基-[1,1'-联苯]-4,4'-二基)双(氧基))双(亚甲基))双(环氧乙烷); 结晶型四甲基联苯二酚环氧树脂; 联苯型结晶环氧树脂(TMDE); 3,3',5,5'-Tetramethyl-4,4'-diphenol diglycidyl ether; 2,2'-{[3,3'5,5'-tetramethyl(1,1'-biphenyl)-4,4'-diyl]bis(oxymethylene)}bisoxirane; Tetramethylbiphenyl diglycidyl ether; 3,5,3`,5`-Tetramethyl-4,4`-di(2,3-epoxypropanoxy)bibenzene; Oxirane, 2,2-(3,3,5,5-tetramethyl1,1-biphenyl-4,4-diyl)bis(oxymethylene)bis-; 4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl(1,1'-biphenyl); 4,4-DIGLYCIDYLOXY-3,3,5,5-TETRAMETHYL BIPHENYL; 3,3’,5,5’-Tetramethyl-4,4’-(diglycidyloxy)biphenyl; 2-[[4-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]-2,6-dimethylphenoxy]methyl]oxirane; 4,4-Bis(glycidyloxy)-3,3,5,5-tetramethylbiphenyl; 2,2'-[(3,3',5,5'-Tetramethyl-4,4'-biphenyldiyl)bis(oxymethylene)]dioxirane; 2,2'-[(3,3',5,5'-Tetramethylbiphenyl-4,4'-diyl)bis(oxymethylene)]dioxirane; 2,2'-[(3,3',5,5'-Tetramethylbiphenyl-4,4'-diyl)bis(oxymethylene)]bisoxirane; 2,2'-[(3,3',5,5'-Tetramethyl[1,1'-biphenyl]-4,4'-diyl)bis(oxymethylene)]bis(oxirane)
- 用途
- 作为电子封装材料（如环氧塑封料）的主要结构材料，具有低粘性、良好粘结性、溶解性、高韧性，可大量填入球形二氧化硅填料，降低热膨胀系数；也广泛用作多种型材、涂料、胶黏剂、复合材料树脂基体，特别是在电子封装材料中具有理想的电绝缘性能。
