将酯官能团替换为氨基官能团,为哌嗪基CCR5拮抗剂提供关键的结构单元。
医药
合成路线 1(1. 合成:189442-87-3)
产率:100%
合成条件:With lithium diisopropyl amide In tetrahydrofuran at -78 - 20℃; for 2.50 h; Inert atmosphere
实验步骤:将N-Boc-哌啶-4-羧酸乙酯(10.00g,36.92mmol)溶解在THF(100mL)中并冷却至-78℃。 加入LDA(47mmol,23mL)并将反应搅拌1小时。 然后加入碘甲烷(81.25mmol,5.08mL)并将反应物再搅拌1小时,然后取出冷浴并使反应物温热至室温。 持续30分钟 用NH 4 Cl(饱和)淬灭反应,并用EtOAc分配,萃取有机物并干燥(MgSO 4)并真空浓缩(定量收率)。 1H NMR(400MHz,DMSO-d6)δ:4.11(q,J 7.1Hz,2H),3.61(dt,J 13.4Hz,J 4.5Hz,2H),2.95(d,J 0.3Hz,2H) ),1.91(d,J 13.6Hz,2H),1.39(s,9H),1.31(m,2H),1.19(m,3H),1.15(s,3H)。
参考文献:
- [1] Patent: WO2015/86527, 2015, A1. Location in patent: Page/Page column 113; 114 [2] Patent: WO2015/86525, 2015, A1. Location in patent: Page/Page column 117 [3] Patent: WO2008/121687, 2008, A2. Location in patent: Page/Page column 43; 89; 94 [4] Patent: WO2006/83003, 2006, A1. Location in patent: Page/Page column 36-37 [5] Journal of Medicinal Chemistry, 2017, vol. 60, # 11, p. 4680 - 4692 [6] ACS Medicinal Chemistry Letters, 2013, vol. 4, # 2, p. 244 - 248 [7] Patent: WO2008/89201, 2008, A2. Location in patent: Page/Page column 233 [8] Patent: US2015/152065, 2015, A1. Location in patent: Paragraph 0581 [9] Patent: US2012/88750, 2012, A1. Location in patent: Page/Page column 17; 18 [10] Patent: US2013/252938, 2013, A1. Location in patent: Paragraph 0465 [11] Bioorganic and Medicinal Chemistry Letters, 2013, vol. 23, # 24, p. 6598 - 6603 [12] Patent: US2010/137305, 2010, A1. Location in patent: Page/Page column 36 [13] European Journal of Medicinal Chemistry, 2015, vol. 103, p. 289 - 301 [14] Bioorganic and Medicinal Chemistry Letters, 2004, vol. 14, # 14, p. 3675 - 3678 [15] Patent: US6083949, 2000, A [16] Patent: US5717100, 1998, A [17] Organic Process Research and Development, 2009, vol. 13, # 6, p. 1145 - 1155 [18] Patent: EP854870, 2009, B1. Location in patent: Page/Page column 41-42 [19] Patent: EP2511275, 2012, A1. Location in patent: Page/Page column 15 [20] Patent: WO2012/140020, 2012, A1. Location in patent: Page/Page column 31-32 [21] Patent: WO2018/172984, 2018, A1. Location in patent: Paragraph 61